News

Specializing in the development, production, sales and service of semiconductor thermoelectric cooling engineering products

2019

The second phase of Hongchang Electronic Industrial Park project has been approved: a total investment of 0.25 billion yuan is planned to build a new standardized factory building with an additional construction area of about 13000 square meters, purchase advanced equipment such as full-automatic semiconductor thermoelectric refrigeration chip packaging equipment and full-automatic semiconductor online detection system, and build a project with an annual output of 1 million sets of semiconductor thermoelectric refrigeration systems and 10 million copper coated substrates. The products are widely used in semiconductor air conditioning systems, 5G communication base stations, automotive electronics and other electronic substrates.

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