The second phase of Hongchang Electronic Industrial Park project has been approved: a total investment of 0.25 billion yuan is planned to build a new standardized factory building with an additional construction area of about 13000 square meters, purchase advanced equipment such as full-automatic semiconductor thermoelectric refrigeration chip packaging equipment and full-automatic semiconductor online detection system, and build a project with an annual output of 1 million sets of semiconductor thermoelectric refrigeration systems and 10 million copper coated substrates. The products are widely used in semiconductor air conditioning systems, 5G communication base stations, automotive electronics and other electronic substrates.
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In 2020, under the severe situation of the new coronary pneumonia epidemic, the company's management team overcame many difficulties and worked hard to forge ahead, and the second phase of the Hongchang Industrial Park construction project officially started in July as planned.
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In September 2021, the second phase of the project was completed and put into operation, the intelligent workshop infrastructure and most of the automated production process equipment adjustment completed, for the company's large-scale production has laid a solid foundation, the planned monthly production capacity of 1 million semiconductor thermoelectric cooling chips. In December of the same year, it passed the national "two integration management system assessment".
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